Download PDF by Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech: Advanced Interconnects for ULSI Technology

By Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech

discovering new fabrics for copper/low-k interconnects is necessary to the continued improvement of laptop chips. whereas copper/low-k interconnects have served good, taking into consideration the construction of extremely huge Scale Integration (ULSI) units which mix over one billion transistors onto a unmarried chip, the elevated resistance and RC-delay on the smaller scale has develop into a significant component affecting chip functionality.

Advanced Interconnects for ULSI Technology is devoted to the fabrics and techniques that may be compatible replacements. It covers a huge diversity of themes, from actual rules to layout, fabrication, characterization, and alertness of recent fabrics for nano-interconnects, and discusses:

  • Interconnect capabilities, characterisations, electric houses and wiring requirements
  • Low-k fabrics: basics, advances and mechanical  properties
  • Conductive layers and barriers
  • Integration and reliability together with mechanical reliability, electromigration and electric breakdown
  • New techniques together with 3D, optical, instant interchip, and carbon-based interconnects

Intended for postgraduate scholars and researchers, in academia and undefined, this e-book presents a serious evaluate of the permitting expertise on the middle of the longer term improvement of computing device chips.

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Advanced Interconnects for ULSI Technology by Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech

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